High temperature one-part aluminum nitride based adhesive. Perfect for probes and sensors. Excellent for thermal conductivity. Bonds and seals ceramics to ceramics and ceramics to metals in applications up to 3000°F (1650°C).
Ceramabond 865 exhibits a dielectric strength of 187 volts per mil, torque strength of 27 ft-lbs, and coefficient of thermal expansion of 1.5 in/in/°F.
The product must be step cured at 200°F (93°C), 350°F (177°C), and 500°F (260°C) for 2 hours at each temperature. Applied in a thin coat using a brush, spatula or dispenser. The clearance between mating parts at operating temperature should be 2-8 mils (50-200 microns). Blistering may occur if the glue line is too thick or heating too rapid.
